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In a humidity requirement application system, what methods can provide to improve the system reliability?

  1. In different applications, because of production technology, environmental factors of some products, which may lead to the chip works in a high-humidity conditions. In the high humidity condition, there may exist a equivalent large resistance to VDD / VSS / Other PIN, which may affect the chip even the whole system works in unstable state. 
  2. On the aspect of chip, it mainly affects chip crystal start-up performance. As XIN is oscillation signal input port, it is vulnerable to external signals.
There are two ways to make some improvement: 
(1) After PCB production, remember to do some cleaning of PCB, especially on crystal oscillation circuit part, you can also coat a layer of moistureproof on PCB after the production process completed.
Because after PCB production process completed, there will be a layer of solder paste residues and other impurities. This part of impurities absorb moisture in the air, which led to a greater equivalent humidity on the surface layer of PCB board. 

(2)It is proposed to connect a 1M resistor in series on XIN/XOUT in circuit design, which can improve the chip performance from oscillator circuit interference.